IBM Plans To Glue Microchips Into Stacks Inside Processors
“3D hype is fast wearing out its welcome, but there’s at least one area of industry where the buzzed about term could usher in true innovation.
Announced today as a joint research project, IBM and 3M will work towards the creation of a new breed of microprocessors.
Unlike similar three-dimensional semiconductor efforts by Intel, the two newly partnered outfits plan to stack up to 100 layers of chips atop one another resulting in a microchip “brick.”
Under the agreement, IBM will contribute its expertise on packaging the new processors, while 3M will get to work developing an adhesive that can not only be applied in batches, but’ll also allow for heat transfer without crippling logic circuitry.”