Sticks of RAM May Become “Blocks of RAM”
“Invensas, a subsidiary of chip microelectronics company Tessera, has discovered a way of stacking multiple DRAM chips on top of each other.
This process, called multi-die face-down packaging, or xFD for short, massively increases memory density, reduces power consumption, and should pave the way for faster and more efficient memory chips.
Multi-die face-down packaging is exactly what it sounds like, and the Invensas press release actually describes it a “shingle-like configuration” — i.e. each of the individual dies is staggered slightly, like roofing tiles.”