Sticks of RAM May Become “Blocks of RAM”

September 7, 2011 Leave a comment Go to comments

“Invensas, a subsidiary of chip microelectronics company Tessera, has discovered a way of stacking multiple DRAM chips on top of each other.

This process, called multi-die face-down packaging, or xFD for short, massively increases memory density, reduces power consumption, and should pave the way for faster and more efficient memory chips.

Multi-die face-down packaging is exactly what it sounds like, and the Invensas press release actually describes it a “shingle-like configuration” — i.e. each of the individual dies is staggered slightly, like roofing tiles.”

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