Sticks of RAM May Become “Blocks of RAM”

September 7, 2011 Leave a comment Go to comments

“Invensas, a subsidiary of chip microelectronics company Tessera, has discovered a way of stacking multiple DRAM chips on top of each other.

This process, called multi-die face-down packaging, or xFD for short, massively increases memory density, reduces power consumption, and should pave the way for faster and more efficient memory chips.

Multi-die face-down packaging is exactly what it sounds like, and the Invensas press release actually describes it a “shingle-like configuration” — i.e. each of the individual dies is staggered slightly, like roofing tiles.”

Advertisements
  1. No comments yet.
  1. No trackbacks yet.

Leave a Reply

Fill in your details below or click an icon to log in:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out / Change )

Twitter picture

You are commenting using your Twitter account. Log Out / Change )

Facebook photo

You are commenting using your Facebook account. Log Out / Change )

Google+ photo

You are commenting using your Google+ account. Log Out / Change )

Connecting to %s

%d bloggers like this: